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• [Buy 3 Take 3] Circuit Board Adhesive 5G Thermal Conductive Heatsink Viscous Adhesive Glue Compound Glue CPU Heat Sink Sealant Description: 1.It has excessive strength and quick bonding effect, and is appropriate for instantly attaching diversified components, LEDs and heat sinks. 2.Good thermal conductivity, stable adhesion, vacuum packaging isn't smooth to oxidize and , nice viscosity, short drying time. 3.It has nice conductivity, vast operating temperature differ (-60~200°C), and short-term resistance to 300°C. 4.It has brief floor curing time, lengthy storage period, non-toxic, solvent-free, and may be safely utilized to elastic bonding, heat dissipation, insulation and packaging of electronics, instruments, LEDs, warmth sinks, etc. 5.Instructions: 1) Extrusion of the product immediately throughout use, rubbing the outside of the adherend, and immediately protecting it after use, in case of trial again 2) The surface fixed velocity is expounded to the relative humidity and temperature within the air; the better the temperature, the faster the curing speed, and vice versa. 3) Recommended thickness: 0.1-0.5mm, the thinner the better. 4) Please use solvent to wash the skin of the bonded object earlier than use (such as alcohol), keep away from cleansing with detergent, and follow it after the outside is clean. 6.The equipment is sealing and the product is covered with a vacuum bag to insulate the air and expand the storage time. Specifications: Thermal properties, solid glue adhesion. Specifications: 5g (single) Melting amount: 0 (200°C/24 Hours) Evaporation: 0.001% (200°C/24 Hours) Thermal Conductivity: >0.671W/m-K Impedance: <0.06 Ging Time: 3min (25°C) Track Strength: 25Kg Strength of Connected Buildings: 1.5map Margin Coefficient: >5.1 Scatter Coefficient: <0.005    

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