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Opisy

  • Name: Thermal conductive siliconThermal conductivity:4.8W/M-KSpecification: GD900-SY1 1G/3G/15G/30GPurpose: Can be used for thermal and warmth dissipation of digital components, CPUs, GPUs, MOS tubes, LEDs, temperature controllers, and so forth

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Comptoir des Cotonniers

4.8
(12,350 subskrybentów)
Provided by:Comptoir des Cotonniers

Thermal conductive Grease Paste Silicone Plaster Heat Sink Compound For Cpu Computer GD900 Heat-dissipating Silicone Paste 30g

0.0
$ 8.42
VAT included
Kolor: 3g
3g
1g
7g
15g
30g
Ilość
Tylko 285 pozostało w magazynie
Provided by Comptoir des Cotonniers. Ships from BUYDO

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