説明

• [Buy 3 Take 3] Circuit Board Adhesive 5G Thermal Conductive Heatsink Viscous Adhesive Glue Compound Glue CPU Heat Sink Sealant Description: 1.It has excessive energy and immediate bonding effect, and is suitable for straight attaching various components, LEDs and warmth sinks. 2.Good thermal conductivity, strong adhesion, vacuum packaging isn't easy to oxidize and , good viscosity, quick drying time. 3.It has good conductivity, huge working temperature range (-60~200°C), and short-term resistance to 300°C. 4.It has brief surface curing time, lengthy garage period, non-toxic, solvent-free, and can be safely applied to elastic bonding, heat dissipation, insulation and packaging of electronics, instruments, LEDs, heat sinks, etc. 5.Instructions: 1) Extrusion of the product straight during use, rubbing the skin of the adherend, and directly overlaying it after use, in case of trial again 2) The floor constant pace is related to the relative humidity and temperature within the air; the higher the temperature, the speedier the curing speed, and vice versa. 3) Recommended thickness: 0.1-0.5mm, the thinner the better. 4) Please use solvent to scrub the surface of the bonded object earlier than use (such as alcohol), keep away from cleaning with detergent, and observe it after the surface is clean. 6.The equipment is sealing and the product is roofed with a vacuum bag to insulate the air and broaden the storage time. Specifications: Thermal properties, stable glue adhesion. Specifications: 5g (single) Melting amount: zero (200°C/24 Hours) Evaporation: 0.001% (200°C/24 Hours) Thermal Conductivity: >0.671W/m-K Impedance: <0.06 Ging Time: 3min (25°C) Track Strength: 25Kg Strength of Connected Buildings: 1.5map Margin Coefficient: >5.1 Scatter Coefficient: <0.005    

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