Description

• High Hard Epoxy Resin Potting Adhesive Soft Silicone Electronic Potting Glue Insulated Waterproof Circuit Board Pouring SealantDescriptionReport ItemSilicone electronic potting glue sealing insulation thermal conduction power battery pack circuit board water-resistant AB delicate glueThis glue is a two-component silicone digital potting glue, with sealing, insulation, thermal conductivity, excessive and coffee temperature resistance, shade is divided into black, gray, transparent, and white, hardness is split into not easy glue and tender glue, the combination ratio is also various , and more merchandise with weight specifications can be customized, please seek the advice of us for detailsPackaging upgrade, label style is different, please do not order when you mindparameterName: Silicone digital potting AB glueSpecifications: 200gColor: black, white, clear, grayMixing ratio: 1:1Operation time: about 30 minutesCuring time: 1-10 hours for initial curing, 24 hours for complete curingFeatures: insulation, waterproof, thermal conductivity, confidentiality, anti-corrosion, anti-vibration, flame retardantApplication areas: diverse sensor potting, precision electronic module potting, lighting fixture potting, power module potting protection, etc.H598 is a gray, low viscosity two ingredient addition molding silicone sealant that can be cured at room temperature or heated after being jumbled in a weight ratio of 1:1. It has the characteristic of quicker curing at greater temperatures. This product does not produce any by-products or pressure in the course of the curing process, and will not trigger pressure pressure on electronic devices; Applied to various electronic products for sealing and protection, it has applications comparable to sealing, waterproofing, insulation, thermal conductivity, flame retardancy, etc. After curing, it can be used in environments starting from -50 ℃ to two hundred ℃.Product Features1. Sealing, insulation, waterproof and moisture-proof, dustproof and anti-corrosion.2. Glue has good flowability, self leveling, and good permeability.3. Flame retardant grade UL94-V-0, with good flame retardant effect.4. High temperature resistance of 2 hundred ℃, low temperature of -50 ℃, and good aging resistance.5. Soft gel after curing, non adverse electronic components, detachable, and repairable.6. Mix and solidify consistent with a weight ratio of 1:1, with clear-cut operation and can be manually poured or automatically poured by means of machine.7. After mixing, it can be naturally cured or quickly cured via heating (the higher the temperature, the faster the curing speed).Typical Applications◆ Automotive electronics and modules ◆ LED strength force module ◆ Solar module junction box ◆ Electric vehicle charging column module ◆ Lithium battery pack, capacitor financial institution ◆ Magnetic induction coil ◆ Inverter energy supplytechnical parameterBefore curingAppearance and morphologyComponent A: Grey liquidComponent B: White liquidViscosity (cps. 25 ℃): Component A: 3500-4500Component B: 3500-4500Mixing ratio A component: B component=100:100 (weight ratio)Room temperature utilization time (25 ℃): 30-50minForming time (h)30 ℃ Forming time: 1-3h25 ℃ Forming time: 3-5 hoursForming time at 20 ℃: 5-10 hoursCuring time (25 ℃): 24 hours (25 ℃ -30 minutes)After curingAppearance: Gray elastomerHardness (Shore A): 55-65Thermal conductivity coefficient (W/m.K): 1.0Elongation at destroy (%): 200-350Volume resistivity (Ω · cm): ≥ 1.0 × 10[14]Breakdown voltage (kV/mm): 18-25Dielectric loss perspective tangent (1MHz): ≤ four × 10[-3]Dielectric constant (1.0MHz): 2.6-3.1Operating temperature vary (℃): -50~200*The above records news is for reference only, and the explicit size by means of the person shall prevail! Not used as a foundation and conventional for acceptance!Usage Guidelines1. Before mixing: First, position factor A and component B in their respective boxes and stir thoroughly.2. When mixing: The weight ratio of A element to B element must be followed at 1:1, and the aggregate should be stirred evenly.3. Bubble removal: After mixing the rubber material, it is going to be vacuumed for 1-3 minutes.4. Sealing: The combined adhesive needs to be poured into the poured product as quickly as possible to circumvent thickening and poor fluidity of the adhesive within the later stage.5. Curing: Cure at room temperature for 24 hours, or at elevated temperature. The higher the temperature, the faster the curing speed.matters wanting attention1. The adhesive needs to be kept in a sealed and dry room temperature environment, and the combined adhesive should be used up as soon as probable to circumvent waste.2. This product is not a hazardous material, yet don't enter or eye contact.3. This product is non-toxic, has nice physiological inertness, and has no inflammation or damage to the skin.4. The product would not involve flammable and explosive components, and will not trigger hearth or explosion accidents. There are not any special requirements for transportation.

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