विवरण

• BGA IC Adhesive Glue Removing Epoxy Remover Cell Phone CPU Chip Cleaner 20ml BGA-IC Repair Remove LiquidFeature:20ml BGA IC glue epoxy remover.Can show you how to melt & remove resinating / sealing glue of chip BGA IC of mobile phones easily.Can quickly melt and unfasten solidified resin adhesive akin to epoxy, phenolics, acrylate, polyurethane, organosilicon etc.It won't do damage to your circuit board and components.Environment pleasant and safe. Doesn't involve any Benzene Coderivative components with cause leukaemia.Convenient to apply How to Use:1. Pick an greater length absorbent cotton than BGA IC with a tweezers and dip into the cutting off liquid. Then hide it lightly on BGA IC chip which in need of glue removing.2. Place a plastic bag or film at the top and cover the PCB board.3. Wait for approximately 20 minutes.4. Redo step 1 to step 3.5. To remove the softened sealing glue within the outside of BGA IC chip with a tweezers. Please listen in on avoid unfavorable routes surrounding BGA and copper foil circuit around main board when cutting off the glue.6. Heat up the chip with a air instrument (300 deg.C). The glue within the bottom gets melt and soften by heat.7. To eliminate the chip with a tweezers or cutterPackage included:1 x BGA Glue

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